FPGA可编程逻辑器件芯片XC6SLX9-3CPG196I中文规格书

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摘要:ThermalManagementStrategyAsdescribedinthissection,Xilinxreliesonamulti-prongedapproachwithregardstotheheat-dissipatingpotentialof7seriesdevices.Cavity-UpPlasticBGAPackagesBGAisaplasticpackagetechnologythatutilizesareaarraysolderballsatthebottomofthepackagetomakeelectricalcontactwiththecircuitboardintheuserssystem.Theareaarrayformatofsolderballsreducespackagesizeconsiderablywhencomparedtoleadedproducts.Italsoresultsinimprovedelectricalperformanceaswellashavinghighermanufacturingyields.Thesubstrateismadeofamulti-layerBT(bismaleimidetriazene)epoxy-basedmaterial.PowerandGNDpinsaregroupedtogetherandsignalpinsareassignedtotheperimeterforeaseofroutingontheboard.Thepackageisofferedinadie

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